Texas Instruments (TI) (NASDAQ: TXN) today announced the launch of its low-cost development kit on its fifth anniversary of the launch of the LaunchPad development kit, the first LaunchPad for the Delfino family of MCUs. Based on the TI C2000 Delfino F28377S MCU, the LaunchPad offers 200-bit 32-bit floating-point performance, a newly integrated accelerator, and high-intelligence analog and control peripherals. In addition, the LaunchPad is also compatible with digital power BoosterPack and motor-driven BoosterPack, and offers a variety of software support to further simplify development. Delfino LaunchPad dramatically reduces the development of high-performance control systems for digital power, solar, motor control and industrial drive applications. Highly integrated Delfino LaunchPad The C2000 Delfino F28377S MCU LaunchPad is based on TI's 32-bit, bringing the performance of the TI LaunchPad ecosystem to a new level. With a powerful combination of the C28x core and the CLA real-time coprocessor, the new LaunchPad outperforms the existing C2000 LaunchPad while delivering 400 MIPS of floating point performance. The MCU is further accelerated by the Trigonometric Unit (TMU) and the Viterbi Complex Math Unit (VCU II). The TMU allows the chip to quickly perform trigonometric-based algorithms in the transform and control functions, while the VCU II accelerates the power line. Communication algorithms and complex mathematical operations. In addition, the MCU integrates complex analog and control peripherals, including a more flexible PWM architecture, two ADCs that provide 12-bit mode support on the LaunchPad, six ΔΣ sinc filters, four window comparators, and many more. Other control and communication peripherals. Simplify motor control and digital power development The C2000 Delfino F28377S MCU with digital power BoosterPack and motor-driven BoosterPack helps designers use the F28377S MCU for leapfrog development of digital power and motor control. The PowerSUITE in the controlSUITETM software tool supports the LaunchPad, which provides centralized software development including examples, header files, and application files. In addition, designers can download the Code Composer StudioTM Integrated Development Environment (IDE), an intuitive programming interface and debugging tools, and TI-RTOS for free to support the development of multitasking applications. Altair's model-based simulation tools provide additional support for TI's C2000 F28377S MCU in the VisSim software tool. The C2000 Delfino F28377S MCU LaunchPad (LAUNCHXL-F28377S) is now available for quick and easy development of next-generation industrial control designs. Compatible digital power BoosterPack () and motor driven BoosterPack (BOOSTXL-DRV8301) are also available. Users can purchase the above products through TI Store and authorized distributors. In addition, users can also choose the LaunchPad (LAUNCH-XS-BUCKCONV) with the digital power BoosterPack or the LaunchPad (LAUNCH-XS-DRV8301) with the motor-driven BoosterPack through the TI Store. To further simplify development, users can also download for free, Energia, and Code Composer Studio IDE via ti.com. Currently, TI's C2000 Delfino has begun to supply samples. At the same time, TI will provide designers with more differentiated products in the series with different memory and peripheral combinations in the TMS320F28375S and TMS320F28374S configurations. Paper Covered Flat Copper Wire
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About Paper Covered Flat Copper Wire
As per Inner Conductor: Paper wrapped bare
Bare Wire Round Wire:Φ1.00mm-Φ5.00mm
Rectangular Wire thickness a:1.00mm-5.60mm
Width b:2.00mm-16.00mm
Conductor of Composite wires
Max wrapping layers once: 24 layers for Paper Covered Wire
4 layers per wire and 16 layers outside for composite wires
We could offer products of special requirements on conductor size, insulation layer thickness, or wire number of the composite.