The General Assembly launches QCC5100 Bluetooth system-on-a-chip with high performance and low power consumption based on Qualcomm

On July 5th, 2018, the leading semiconductor component distributor dedicated to the Asia-Pacific region---Lianda Holdings announced that its subsidiary, Qualcomm, launched the QCC5100 series of high-performance, low-power audio platforms for Qualcomm, supporting TWS Bluetooth headset and speakers.

The QCC5100 series of breakthrough Bluetooth system-on-chips (SoCs) can support the next generation of Qualcomm TrueWireless technology. Compared with previous generation devices, this series of SoCs can reduce power consumption by 65% ​​in terms of voice calls and music streaming. This fully integrated single-chip solution uses a 4mm x 4mm chip scale package (CSP) to provide manufacturers with an efficient way to control and manage true wireless connections in earbuds. Its supporting audio development kit can support the development of next-generation highly compact and feature-rich wireless earplugs and ear-worn devices.

component

QCC-5121 (CSP)

QCC-5120 (BGA)

QCC-5124 (BGA)

The General Assembly launches QCC5100 Bluetooth system-on-a-chip based on Qualcomm's high-performance and low-power consumption

Figure 1-The system architecture diagram of the QCC5100 series of Qualcomm high-performance, low-power audio platform launched by Dalian Daquanding

Product specifications

Support Bluetooth 5.0 (2Mbps Bluetooth low energy consumption);

Powerful quad-core processor architecture: dual-core 32-bit processor application subsystem, dual-core Qualcomm®KalimBA™DSP audio subsystem, embedded ROM+RAM and external Q-SPI flash memory;

Audio subsystem: dual 120 MHz 32-bit Qualcomm® KalimBA™ DSPs, which can save power at 80MHz, 32MHz or 2MHz. Qualcomm® KMYLAR™ system DSP architecture, 256KB data RAM, 80KB program RAM (Inc Cache), 192kHz 24-bit;

Digital audio interface: 3 PCM/I2S interfaces, up to 192kHz/ 24-bit, 1 S/PDIF input + 1 S/PDIF output, up to 96kHz/24-bit, support local MCLK, SPI and I2C can be used to control external peripherals (E.g. codec), 6 digital microphones;

Analog interface: differential headphone driver, Class D or AB mode, 2ch 98 DBA signal-to-noise ratio (typical) Headphone Class D, DAC supports up to 192kHz/24-bit sampling rate, high-quality line-level ADCs, 2-ch 96 DBA signal Noisy (typical) line input (single-ended), ADC supports sampling rate up to 96kHz / 24-bit;

Serial interface: UART, Bit Serializer (I2C/SPI), USB2.0;

Integrated PMU: dual switching power supply for system/digital circuit;

Integrated lithium-ion battery charger;

124-ball 6.5×6.5×1mm VFBGA (and other packages) double-string current balance using a single LED driver.

Product Features

Support BT5.0 (2 Mbps);

Support Qualcomm TrueWireless@ Stereo & Plus;

Support low power consumption "7Ma;

Support hybrid ANC;

Qualcomm's unique aptX / aptX LL / aptX HD decoder;

Always support voice and broadcast audio;

Support EMMC I/F (SDIO) (Qcc5120 / 5124);

Applications

Bluetooth headset (QCC-5121 / 5120);

TWS Bluetooth headset (QCC-5121);

Bluetooth speaker (QCC-5120 / 5124);

TWS Bluetooth speaker (QCC-5120 / 5124).

About UNGA Holdings:

General Assembly Holdings is the world's largest distributor of semiconductor components with a leading market share in the Asia-Pacific region. Headquartered in Taipei (TSE: 3702), it owns World Peace, Pinjia, Chuanding and Youshang, and has about 5,100 employees. There are more than 250 distributors, and there are about 71 IEDs & 34 Non-IED distribution locations worldwide (43 IEDs & 34 Non-IEDs in the Asia-Pacific region), with a turnover of 17.51 ​​billion US dollars in 2017. (*Market ranking is based on data released by Gartner)

UNGA Holdings created an industrial holding platform, continued to optimize the front-end marketing and logistics support team, acted as a professional partner in the industrial supply chain, and provided demand creation, turnkey solutions, technical support, warehousing logistics and IC Value-added services such as e-commerce meet the needs of different customers such as original equipment manufacturers (OEM), original design manufacturers (ODM), electronic manufacturing service providers (EMS) and small and medium enterprises. With an international scale of operation and localized sales channels, it has been deeply engaged in the Asia-Pacific market for a long time, and has been selected as the "Best IC Distributor in Asia" by professional media for years.

In order to improve the localized service quality of the General Assembly and meet the differentiated needs of customers in the Greater China region, the General Assembly (China) serves six major areas including China Based Manufacturers and Taiwan-Based Manufacturers. , Foreign businessmen (Electronic Manufacturing Service), Japanese businessmen (Japan-Based Manufacturers), Korean businessmen (Korea-Based Manufacturers) and Hong Kong businessmen (Hong Kong-Based Manufacturers) customers. In addition to providing customers with the best turnkey solution (Turnkey Solution), the United Nations General Assembly also established a dedicated small-quantity service team (SQS, Small Quantity Service) to meet customers' small-volume device procurement needs. The General Assembly has established the General Assembly Commerce, General Assembly Commerce (Shenzhen) and General Assembly Electronics (Hong Kong) in the Mainland and Hong Kong respectively. With the corporate vision of "Industry First Choice. Channel Benchmarking", it has fully implemented "Team, Integrity, The core values ​​of "professionalism and efficiency", with professional services, achieve mutual benefit and win-win results for suppliers, customers and shareholders.

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