Vishay Releases Free Online Simulation Tool for Power MOSFETs

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Recently, Vishay Intertechnology, Inc. (NYSE ticker symbol: VSH) today introduced a power MOSFET, microBUCK DrMOS power IC products and free online thermal simulation tool ThermaSim version ^3.0?. To accurately analyze the simulated temperature profile, the powerful new version of ThermaSim introduces many key features such as die-temperature scaling of power dissipation, defining more real-world conditions to improve simulation accuracy and design flexibility, and to reduce User experience requirements.

Other thermal simulation tools can only perform package-level simulations, while ThermaSim uses finite element analysis (FEA) techniques to improve accuracy. This free online tool is especially useful in high current, high temperature applications such as automotive, fixed line communications, desktop and notebook computers, and industrial systems. The latest version of the simulation tool is also ideal for applications with small headroom and applications that are subject to transient conditions such as UIS (un-clamped inductive switches) and automotive load dumps.

ThermaSim enables designers to perform detailed thermal simulations of Vishay Siliconix's power MOSFETs , ICs and DrMOS products before product prototypes, reducing time to market. For highly trusted designs, ThermaSim 3.0 offers a number of new and improved features in many ways, including the following:

Transient thermal simulation (for MOSFET only):

Time-scaling (maximum 1000 levels) of simulated power dissipation data improves design reliability. This method can be scaled at multiple locations over the time period of the simulation curve, especially for high power pulses (kW levels) and short durations (≥1 ns). In addition, the tool can act as a thermal sink with 10%, 15%, or 25% of the original MOSFET die area for better analysis of low gate drive and drain-source voltage spikes.

Improve the user experience:

To save time and eliminate the possibility of data entry errors, ThermaSim 3.0 allows users to upload ^Excel? Data packet format of the power curve, can be repeated many times as necessary to upload the data packet, and when a user exchangeable between needed and the entire design of the simulation results Copy. In addition, powerful tools use a graphical display to place components on the PCB.

Simulate according to "real conditions":

Users can even define more conditions, including copper diffusion on the top and bottom PCBs, solder thickness, solder joint quality, air gap, glue/spacer thickness, and wire termination on or off the PCB.

Efficient simulation:

Asynchronous reloading and web interface (Ajax), as well as load balancing and high mesh resolution, get simulation results faster.